K24V3

Introduction

The K24V3, a new-generation high-density multi-node server, supports both Intel and AMD platforms. Featuring compatibility with 3 types of single-socket/dual-socket compute nodes, it is tailored for high-performance computing optimization. The dual-socket configuration accommodates both air cooling and liquid cooling, with cold plates covering CPUs, DIMMs, and VR within a node. This approach achieves a high liquid cooling ratio, effectively reducing system power consumption and operating noise, and meeting the low PUE demand, assisting customers in building a new generation of green high-density data centers.

Key Features

Security and reliability

Precise leak detection solution for real-time location of leakage nodes and automatic power cut-off, effectively reducing risks.
Liquid-cooled cabinets with support for temperature, humidity, liquid leakage, and smoke detection and alarm functions, equipped with intelligent management platform for dynamic environment monitoring.
Efficient liquid cooling

Highly reliable integrated cold plate design covering CPUs, DIMMs, and VR, supporting 45°C (medium and high-temperature) water inlet cooling, meeting the demand for low PUE.
Efficient, energy-saving, green, and low-carbon liquid cooling significantly reducing fan speed, optimizing the O&M environment of the server room and maintaining a moderate noise level.
High-density deployment

Quadrupling deployment density compared to traditional rack servers, efficiently accelerating server deployment.
Enhancing cabinet utilization in the face of insufficient space in users' server rooms; supporting integrated cabinet delivery, greatly simplifying the deployment procedure.
Leading performance

Delivering industry-leading CPU computing power, supporting 8 5th Gen AMD EPYC™ 9005 series processors within a 2U space.
Featuring a disruptive system architecture design, enabling multi-host mode for high-bandwidth node interconnection.

Technical Specifications

Chassis Model	Maintenance	Cooling
K24-E3-A0-R0-00	Rear I/O	Air cooling
K24-E3-C0-R0-00	Rear I/O	Cold-plated liquid cooling
Form Factor	2U rack chassis, including 4 independent hot-swap dual-socket compute nodes
Storage	Configuration 1: 8× 2.5-inch SATA/NVMe SSDs (7mm) Configuration 2: 4× 2.5-inch SATA/NVMe SSDs (15mm) No-drive configuration (optional)
Power Supply	4x N+N redundant hot-swap 2,700W/3,200W Titanium PSUs
System Cooling	4x or 5x front 8086 system cooling fans with N+1 redundancy
Node Model	Maintenance		Cooling
KM1280-E3-A0-R0-00	Rear I/O		Air cooling
KM1280-E3-C0-R0-00	Rear I/O		Cold-plated liquid cooling
Form Factor	1U half-width dual-socket compute node
Processor	2x 5^th Gen AMD EPYC™ 9005 series processors per node, up to 500W TDP
Memory	Up to 24x DDR5 RDIMMs (6,400MHz) per node
PCIe Expansion	Air cooling: 1 PCIe 4.0 x16 slot + 1 PCIe 5.0 x16 slot per node Liquid cooling: 1 PCIe 5.0 x16 slot per node
Multi-host Network	Supporting the multi-host mode, enabling uniform access and management of 2 nodes with 1 multi-host NIC
Storage	Configuration 1: 2× 2.5-inch SATA/NVMe SSDs (7mm) per node Configuration 2: 1× 2.5-inch SATA/NVMe SSDs (15mm) per node 1× internal SATA/PCIe M.2 SSDs per node

Introduction

Key Features

Security and reliability

Efficient liquid cooling

High-density deployment

Leading performance

Technical Specifications