KR1280V3

Introduction

The KR1280V3, a 1U2S high-density computing server series, accommodates 2 Intel® Xeon® 6 or 5th Gen AMD EPYC™ 9005 series processors with the highest TDP in a 1U form factor. It boasts an exceptional design in computing performance, storage density, and scalability, and provides the industry's widest range of multi-layer storage matrices, ideal for compute-intensive scenarios like high-performance computing, high-frequency transactions, and virtualization. To optimize the PUE, it incorporates varied heat dissipation methods, including EVAC and cold-plated liquid cooling, meeting the low PUE requirements of data centers.

Key Features

Efficient carbon reduction, eco-friendly and energy saving

Offering efficient cooling solutions like EVAC and cold-plated liquid cooling, delivering comprehensive liquid cooling solutions for data centers. With full-stack liquid cooling capabilities, the server minimizing PUE to below 1.1.
Adhering to environmental protection principles, the server's key components complying with lead-free (RoHS) standards, and all packaging materials being recyclable.
Innovative architecture, hassle-free O&M

Featuring innovative front I/O, facilitating O&M operations in the cold aisle, reducing maintenance challenges, extending the service life of thermo-sensitive components like optical modules and smart NICs, and enhancing data transmission stability.
Ultimate flash storage, versatile experiences

Supporting up to 12 front 2.5-inch SAS/SATA/NVMe drives, and innovatively offering 32 PCIe 5.0 E1.S SSDs directly connected to the motherboard, achieving an ultimate flash memory density of 512TB in a 1U space. Ideal for large language model scenarios with rapidly expanding data volumes and the need for higher processing efficiency. Storing data quickly, computing faster.

Technical Specifications

Model	Maintenance	Cooling
KR1280-X3-A0-R0-00	Rear I/O	Air cooling
KR1280-X3-A0-F0-00	Front I/O	Air cooling
KR1280-X3-C0-R0-00	Rear I/O	Cold-plated liquid cooling
Processor	1 or 2 Intel® Xeon® 6 processors
Memory	32x slots for DDR5-5600/6400 DIMMs, allowing for the installation of up to 16x MCR DIMMs (8,000MT/s) (GNR) 4× CXL 2.0 E3.S SSDs
Storage	Front: 8/10/12× 2.5-inch SAS/SATA/NVMe drives \| 4× 3.5-inch SAS/SATA/NVMe drives + 4× E3.S SSDs \| 32× E1.S SSDs \| 4× 1/2TB E3.S SSDs/4× 2.5-inch SAS/SATA/NVMe drives/12× E1.S SSDs (front I/O) Internal: 1× TF card and 2× SATA M.2 SSDs \| 2× NVMe M.2 SSDs Rear: 2× 2.5-inch SAS/SATA drives
PCIe Expansion	Rear I/O: Up to 7x PCIe slots, including 2x slots for hot-swap OCP 3.0 NICs. (Front: 2x PCIe cards; Rear: 3x PCIe cards and 2x OCP 3.0 NICs) Front I/O: Up to 7x PCIe slots. (Front: 2x PCIe cards and 1x OCP 3.0 NICs; Rear: 2x PCIe cards and 2x OCP 3.0 NICs) Liquid cooling: Up to 5x PCIe slots, including 1x slot for a hot-swap OCP 3.0 NIC
Power Supply	1+1 redundant Titanium/Platinum CRPS PSUs with an output power of 800W/1,300W/1,600W/2,000W/2,700W/3,200W
Operating Temperature	5°C to 50°C (Refer to the White Paper for details)