KE2260V2

Dual BMC redundant architecture supports hot-switching, with firmware updates that do not disrupt business continuity. Optimized cooling structure and thermal regulation strategies ensure low-noise operation suitable for human-machine coexistence. All boards feature triple-proof coating, with optional front dust filters, making it adaptable to harsh environments with temperatures ranging from 0~45°C, high humidity, and dust.

Utilizes hundreds of sensors combined with intelligent thermal control strategies to precisely manage component temperatures and overall power consumption.

Cloud-based intelligent operation platform enables remote diagnostics, reducing on-site maintenance frequency and lowering operational costs. 

Supports front and rear I/O maintenance designs, featuring tool-free assembly/disassembly and hot-swappable OCP network cards.

Optimized for edge AI, it supports optional configurations of 2 double-width or 6 single-width GPU acceleration cards to meet diverse computing needs. Modular storage design allows hybrid configurations: 8x 2.5-inch or 4x 3.5-inch + 4x 2.5-inch drives,  with dual built-in M.2 SSD expansion. Offers 4G/5G/WiFi multi-module expansion solutions, ensuring reliable network connectivity in complex environments.

Supports dual 4th/5th Gen Intel® Xeon® Scalable Processors, with up to 32 cores per processor and 225W TDP. Equipped with 16 DDR5 ECC RDIMM memory slots, supporting 4800/5600MT/s speeds, significantly enhancing system performance and stability. With a depth of only 450mm, it complies with OTII 2U 2.0 specifications, making it ideal for space-constrained edge data centers and enabling rapid deployment.